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EU TendersSilicon Austria Labs - Chips JU: Wafer bumper
Title in German as published on TED.
Contract award notice published on TED on 3 Jun 2026 by Silicon Austria Labs GmbH (Austria), CPV 38000000 Laboratory, optical and precision equipments (excl. glasses). Awarded to Pac Tech - Packaging Technologies GmbH for EUR 1,260,320.
| Notice | 378296-2026 (can-standard) |
|---|---|
| Status | Contract award |
| Published | 3 Jun 2026 |
| Buyer | Silicon Austria Labs GmbH, Graz |
| Country | Austria |
| Main CPV | 38000000-5 Laboratory, optical and precision equipments (excl. glasses) |
| Contract type | supplies |
| Procedure | neg w call |
| Estimated value | EUR 1,260,320 excl. VAT |
| Awarded value | EUR 1,260,320 |
| Tenders received | 1 |
| Award decision | 8 May 2026 |
Daily EU tender alerts
Basic $19 a month, up to 5 filters. Pro $49 a month, up to 30 filters and tenders closing within 5 days. Charged in UAH at the National Bank of Ukraine rate on the payment day.
Description
The aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of an automated wafer soldering bumping tool as well as services such as trainings for Silicon Austria Labs GmbH.
Lots (1)
| Lot | Title | Estimated value | Deadline |
|---|---|---|---|
| LOT-6531 | Silicon Austria Labs - Chips JU: Wafer bumper | EUR 1,260,320 |
Winners
- Pac Tech - Packaging Technologies GmbH Nauen, Germany
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Daily EU tender alerts
Basic $19 a month, up to 5 filters. Pro $49 a month, up to 30 filters and tenders closing within 5 days. Charged in UAH at the National Bank of Ukraine rate on the payment day.