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EU TendersDeep Reaction Ion Etcher (DRIE)
Call for competition published on TED on 8 Oct 2026 by Uppsala universitet (Sweden), CPV 42000000 Industrial machinery.
| Notice | 693624-2026 (cn-standard) |
|---|---|
| Status | Closed tender |
| Published | 8 Oct 2026 |
| Buyer | Uppsala universitet, Uppsala |
| Country | Sweden |
| Main CPV | 42000000-6 Industrial machinery |
| Contract type | supplies |
| Procedure | open |
| Estimated value | SEK 1 excl. VAT |
| Deadline for tenders | 10 Nov 2026 00:00 |
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Description
Myfab Uppsala aims at purchasing a Deep Reaction Ion Etcher (DRIE). The purpose of the tool is to transfer patterns defined by e.g., photo- and electron beam lithography covering the pattens size range from all substrate range down to a few nanometres. The system will be used by many operators in a university laboratory environment. It must be easy to use and be insensitive to frequent change of process between batches. The processes include broad range of etching capability: low to high etch rate, wafer dicing, high uniformity, high open area, high aspect ratio, and nanometre scale. The system is intended for etching of silicon as well as other materials compatible with silicon etching, with both photoresist resins and hard masks for patterning.
Lots (1)
| Lot | Title | Estimated value | Deadline |
|---|---|---|---|
| LOT-0001 | Deep Reaction Ion Etcher (DRIE) | 10 Nov 2026 |
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