Advanced oxide and metal etcher

Contract award notice published on TED on 29 Oct 2026 by TEKNOLOGIAN TUTKIMUSKESKUS VTT OY (Finland), CPV 38000000 Laboratory, optical and precision equipments (excl. glasses).

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Description

The object of the procurement is an advanced plasma etch cluster tool to etch metal and thin film layers from 200 mm silicon wafers, as used in the Semiconductor industry. VTT expects a reliable production-worthy tool. The tool should have the capacity for at least four process chambers and other features, which are described below. DIRECT AWARD, Article 40 2(2) of Finnish Procurement act (1397/2016) The procurement will be carried out as a direct award in accordance with 40 article Section 2(2) of the Finnish Public Procurement Act. According to the 40 § section 2(2) of the Act on Public Contracts (1397/2016), only a certain supplier can implement the procurement for a technical reason, or for a reason related to protecting an exclusive right; it shall be a further condition that there are no reasonable alternatives or substitute solutions, and that the absence of competition is not due to an artificial narrowing of the terms and conditions of the procurement. VTT is acquiring an advanced plasma etch cluster tool for the etching of metal, dielectric and other thin-film layers on 200 mm semiconductor wafers. The equipment will support a broad range of research, development and pilot-line processes, including metal and high-k material etching. A single cluster platform is required to provide production-level process reliability, uniformity and reproducibility while retaining the process flexibility required in a research and technology organisation. The tool configuration is based on the technical needs arising from the intended use. The mandatory capabilities include: (i) a

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