Metal CMP and brush cleaner

Contract award notice published on TED on 11 Nov 2026 by TEKNOLOGIAN TUTKIMUSKESKUS VTT OY (Finland), CPV 38000000 Laboratory, optical and precision equipments (excl. glasses). Awarded to Applied Materials South East Asia Pte Ltd for USD 4,148,000.

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Description

THE OBJECT OF THE PROCUREMENT The procurement concerned the delivery of an automatic metal Chemical Mechanical Polishing (CMP) system with an integrated wafer cleaner for processing and planarization of 200 mm semiconductor wafers. The scope included the fully configured CMP tool, integrated cleaning unit, required accessories, and delivery, installation, and commissioning. Tool was acquired for processing of following applications: 1. Copper and barrier polishing steps for a. Integrated passive components b. CMOS wafers Back-End-of-the-Line (BEOL) and Mid-End-of-the-Line (MEOL) c. Hybrid bonding d. Above structures may include also low K materials which need special cleaning methods 2. Through-silicon via (TSV) a. overburden metallization removal b. Silicon, silicon dioxide and silicon nitride polishing during the TSV back side processing 3. Quantum computing related materials polishing Tool to be acquired needed to be able to deliver industrial level quality & repeatability while allowing flexibility in research and technology organisation environment: polishing is done on both wafers that meet SEMI standards and wafers and wafer stacks with non-standard thicknesses, non-beveled edges with large edge exclusions & fragile edges. Single tool was acquired to serve several polishing processes that include copper, insulators and quantum related materials; several polishing platens for several consumable sets were needed. The polishing tool configuration is based on the above constraints. The equipment includes 3 polishing platens each with integrated in-situ capable pad condit

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Winners

• Applied Materials South East Asia Pte Ltd Singapore, Singapore, size: large

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